Loading...

LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. The product is also suitable for stencil print applications. It has been used successfully in lead-free processes with water and alcohol-based fluxes under conditions outlined in the Environmental Resistance section. 


Qualities and Characteristics

  • One component - requires no mixing
  • High wet strength

Technical Attributes

Storage Temperature 2 - 8 °C

Physical Attributes

Cure Type Heat Cure
Number of Components 1 Part
Viscosity 2-5 Pa∙s
Physical Form Gel
Technology Epoxy

Practical Attributes

Application SMT
Write Your Own Review
You're reviewing:LOCTITE 3627 X 300ML
Your Rating
£217.00 (£260.40 inc VAT)
LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.

Looking for something similar?