LOCTITE 3627 X 300ML
LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. The product is also suitable for stencil print applications. It has been used successfully in lead-free processes with water and alcohol-based fluxes under conditions outlined in the Environmental Resistance section.
Qualities and Characteristics
- One component - requires no mixing
- High wet strength
Technical Attributes
| Storage Temperature | 2 - 8 °C |
Physical Attributes
| Cure Type | Heat Cure |
| Number of Components | 1 Part |
| Viscosity | 2-5 Pa∙s |
| Physical Form | Gel |
| Technology | Epoxy |
Practical Attributes
| Application | SMT |
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£245.00
(£294.00
inc VAT)
LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
