LOCTITE 3609 X 300CC
LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.
Qualities and Characteristics
- One component - requires no mixing
- Designed for bonding surface mounted devices to printed circuit boards prior to wave soldering
- Particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required
- Can be used in lead-free wave solder with both water-based and alcohol-based fluxes
Technical Attributes
| Tensile Shear Strength | 1450 psi Grit Blasted Steel |
| Cure Method | Heat Cure |
| Storage Temperature | 2 - 8 °C |
Physical Attributes
| Number of Components | 1 part |
| Viscosity | 0.16 - 20 Pa∙s |
| Physical Form | Gel |
| Colour | Red |
| Technology | Epoxy |
Practical Attributes
| Application | SMT |
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LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering.
