LOCTITE® 3508 NH is an epoxy underfill. It is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. Also, it can pre-applied to the board at the corners of the pad site using a standard SMA dispenser. 

Qualities and Characteristics

  • Reflow curable
  • Reworkable
  • Eliminates post-reflow dispenses and cure steps
  • Halogen free

Technical Attributes

Tg 118 °C

Physical Attributes

Viscosity 70000 mPa·s

Practical Attributes

Application Underfill
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£85.00 (£102.00 inc VAT)
LOCTITE® 3508 NH is an epoxy underfill.

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