LOCTITE 3508NH X 30ML EFD
LOCTITE® 3508 NH is an epoxy underfill. It is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. Also, it can pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
Qualities and Characteristics
- Reflow curable
- Reworkable
- Eliminates post-reflow dispenses and cure steps
- Halogen free
Technical Attributes
| Tg | 118 °C |
Physical Attributes
| Viscosity | 70000 mPa·s |
Practical Attributes
| Application | Underfill |
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Technical resources
£85.00
(£102.00
inc VAT)
LOCTITE® 3508 NH is an epoxy underfill.
