LOCTITE 3508NH X 30ML EFD
LOCTITE® 3508 NH is an epoxy underfill. It is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. Also, it can pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
Qualities and Characteristics
- Reflow curable
- Eliminates post-reflow dispenses and cure steps
- Halogen free