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LOCTITE® 3513 is a single component epoxy adhesive. It is designed for use as a reworkable underfill resin for CSP(FBGA) or BGA, and it cures rapidly on exposure to heat. Also, it gives give excellent protection from failure due to mechanical stress, and the low viscosity allows filling in gaps under CSP or BGA.


Qualities and Characteristics

  • Single component
  • Cures rapidly with heat exposure
  • Low viscosity

Technical Attributes

Cure Method Heat, high speed

Physical Attributes

Capacity 30ml
Colour Opaque cream yellow
Technology Epoxy

Practical Attributes

Key Substrates SMD components to PCB
Dispense Method Syringe
Application Underfill
Specific Application Reworkable underfill for CSP (FBGA) or BGA
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£64.00 (£76.80 inc VAT)
LOCTITE® 3513 is a single component epoxy adhesive, designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.

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