LOCTITE 3593 X 150ML

LOCTITE® 3593TM is a rapid curing, fast-flowing, liquid epoxy designed for use as a capillary flow underfill for chip size packages. It is designed for production where process speed is a key concern. Its rheology is designed to allow it to penetrate gaps as small as 25 μm. LOCTITE 3593 is easily dispensed, minimizes induced stress, provides improved temperature cycling performance and has excellent chemical resistance.

Qualities and Characteristics

• Technology - Epoxy
• Chemical Type - Epoxy
• Components One component - requires no mixing
• Cure - Heat cure
• Application - Underfill
• Dispense Method - Syringe
• Key Substrates - Electronic components
• Specific Benefit - Process speed
• Reworkable - No