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LOCTITE® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high-speed placement and long printer abandon times. LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.


Qualities and Characteristics

  • Good humidity resistance. Gives excellent coalescence even after 72 hours of exposure to 27ºC/80% RH, reducing process variation due to environmental factors
  • colourless residues for easy post-reflow inspection
  • Soft, non-stick, pin testable residues allow easy in-circuit testing
  • Suitable for fine pitch, high-speed printing up to 150mm/s (6"/s)

Technical Attributes

Viscosity Temperature 77 °F
Shelf Life Temperature 32 - 50 °F
Thixotropic Index 0.54
Filler 88.5
Storage Temperature 32 - 50 °F

Physical Attributes

Viscosity 765000 - 886000 mPa.s (cP) Brookfield
Colour Grey

Practical Attributes

Application Stencil Printing
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LOCTITE® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing.