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Multicore Solders

 

For decades, Multicore® has been the brand assembly specialists trust for all of their soldering requirements. Through leading-edge development, backed by the expertise of the industry’s premiere chemists and engineering experts, Multicore solder materials continue to lead the way for next-generation manufacturing.
 

Always staying ahead of the curve and anticipating market change before it actually happens, Henkel began development of its line of Multicore lead-free products long before the industry at large was even talking about the implications of RoHS. This forward-thinking mindset is what has yielded the industry’s most reliable, capable and trusted brand in solder.

The Multicore portfolio includes market-leading lead-free solder pastes, tin-lead paste formulations for traditional and crossover manufacturing, flux solutions for dual wave and lead-free processes, cored solder wire, solid solder wire and a host of products for delicate hand soldering and re-work operations.

 
V Tech are happy to introduce a new Multicore Paste to the market;
 

LOCTITE HF 212 Halogen-Free Solder Paste

 

LOCTITE HF 212 Applications

Solder Paste for Medium and Large Board Assemblies
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies.  High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.

Halogen Free 

  • Meets all current “Halogen-free” restrictions
  • No added Halogen
  • Halide-free: ROL0 classification in accordance to j-STD-004B
  • Compatible with existing halogen-free solutions

 

Ease of Application

  • Excellent wetting capabilities

Technology Printing and Reflow Advantages

  • Wide process window for printing and minimal slump
  • Fine pitch capability and reduction in solder bridging
  • Excellent abandon time and stencil life
  • Excellent humidity resistance
  • Excellent solderability on challenging surface finishes (includes CuNiZn and Copper OSP)
  • Improves fine pitch coalescence

 

Low Voiding

  • In CSP
  • On industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag
  • Increases solder joint reliability
 
 
V Tech are proud to offer a full range of Multicore products, please contact our sales office for further information. 

Vtech SMT Ltd, Vision House, Throsk, Stirling, Scotland, FK7 7NP
Telephone: +44 (0) 1786 813999 | Fax: +44 (0) 1786 813998 | Email: sales@vtech-smt.co.uk