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Henkel’s portfolio of Underfill materials and products is continually growing, offering next generation systems with impressive designs and mechanical characteristics.

The package-level Underfill systems have been engineered to deliver robust performance. These systems are also able to meet stringent JEDEC testing requirements and ensure Pb-free compatibility. Everything from low Potassium/Copper (K/Cu) die, materials with incredibly long working lives, Snapcure processing alternatives and both fluxing no-flow Underfills and high thermal Underfills are available through Henkel’s line of Underfill products.

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HYSOL 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
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Vtech SMT Ltd, Vision House, Throsk, Stirling, Scotland, FK7 7NP
Telephone: +44 (0) 1786 813999 | Fax: +44 (0) 1786 813998 | Email: